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AVI Intelligent Six-Sided Inspection Systems for Camera Modules

Advanced vision systems combining AI with automated optical inspection for micro-component manufacturing:

  • Automated loading/unloading of micro-components

  • AI-powered high-throughput appearance inspection

  • Real-time defect classification by severity

Application
  • XXX
    Camera Module
  • XXX
    Optical Fingerprint Module
  • XXX
    3D-Sensing Module
  • XXX
    Micro Component
  • XXX
    Wafer Level Component

Product

Related Products
Intelligent AVI Six-Side Camera Inspection System
產(chǎn)品名稱
Intelligent
AVI Six-Side Camera Inspection System
Fully Automated Intelligent AVI Camera Six-Side Inspection System
產(chǎn)品名稱
Fully
Automated Intelligent AVI Camera Six-Side Inspection System
Fully Automated Intelligent AVI Camera Six-Side Inspection System

Fully Automated Intelligent AVI Camera Six-Side Inspection System

FUNCTION

  • Fully automatic loading, unloading, and inspection;
  • It can detect appearance defects on six surfaces of the module (including light holes, holder, FPC, connectors, etc.);
  • Defects include: poor FPC silk printing, connector defects, QR code defects, steel sheet displacement, lens defects, VCM pin welding defects, etc;
  • Automatically complete the six-sided inspection, display the results after discharge, store test images and result data, and calculate the yield.

FEATURE

  • Compatible with deep learning detection and traditional positioning algorithms;
  • The rotating heads of the high-speed double turret are loaded and unloaded separately;
  • Support multi-model fast switching to meet the detection of different models of products;
  • Flexible switching between different sizes of modules (6 nozzles, maximum compatible size 34*20mm)
  • Turntable with up to 12 test stations (including reserved stations);
  • NG disc circulation stacking (optional);
  • feeder pallet loading and unloading;
  • Module film (optional);
  • DUT sorting;

APPLICATION

Suitable for appearance inspection of optical modules, such as camera modules, optical fingerprint modules, structured light modules, etc; It can also flexibly adapt to micro-component or wafer-level components by replacing cameras, light sources, and other components.

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